AI/Fiber-Optic Combo Poised To Improve Telecommunications

September 7, 2023 | NEC Labs America | News | Tags: fiber-optics, AI

Distributed fiber optics sense everything everywhere all at once. Paired with artificial intelligence and machine learning, it can act as an interface between the physical and digital worlds. Existing underground fiber-optic telecommunications cable networks that can be accessed through street manholes are helping a team at NEC Labs America improve wireless communications systems and the Internet of Things (IoT).

“Hundreds of millions of fiber-optic cables are already there for communications purposes,” says Shaobo Han, a researcher at NEC Labs America who focuses on the design and development of machine learning and signal-processing techniques for real-world sensing applications. “We’re turning it all into a ‘thinking’ device, using the same cable that’s already there.”

AI Fiber Optic Combo Poised To Improve Telecommunications

Using the existing cable networks, Han’s team can monitor and track the path of almost any object above ground without installing additional sensors or connecting to wireless networks. The fiber sensing system provides optical as well as acoustic information by using thin-film optoelectronics as an integrator that sends out optical power from lasers to the optical fiber. By analyzing its scattering, information about physical parameters such as acoustical aberration and temperatures can be found.

The story was based on a technical paper in Optica on Ambient Noise-Based Weakly Supervised Manhole Localization Methods Over Deployed Fiber Optic Networks.

Check out the full article in Laser Focus World which provides additional details on practical use cases for this technology, including tracking the movements of objects on city streets.

Read More Blog Posts

Driving the Future of Scene Editing with HorizonForge

Driving the Future of Scene Editing with HorizonForge

HorizonForge introduces a new approach to driving scene generation, enabling precise control over both vehicle behavior and identity. By allowing arbitrary trajectories and flexible vehicle insertion, it creates realistic, scalable simulations for autonomous driving, digital twins, and advanced AI development.
Eric Cool Chips 2026

Eric C. Blow to Deliver Photonic AI Keynote at COOL Chips 29 in Tokyo on April 17th

Eric C. Blow of NEC Laboratories America presents a keynote at COOL Chips 29 in Tokyo, exploring multi-modal photonic computing for real-time, ultra-efficient inference. This work highlights how photonics is reshaping AI performance, enabling faster and more energy-efficient processing across next-generation systems.